serious they are serious that this is what we will get
using a special glue they will be able to stack on many
multiple layers to chips.
in 2013 to start off.
When can we get our hands on this breakthrough tech? IBM’s media relations representative Michael Corrado tells us, “By the end of 2013 it should go into production. It’ll show up on servers first, and then a year after that consumers might see it.”